Software Engineer (Telco Industry)

C

Software Engineer (Telco Industry)

C
Inflancka 4B, Warszawa

Emerge Soft

Full-time
B2B
Mid
Remote
6 703 - 7 541 USD
Net per month - B2B

Job description

Our client is creating innovative mobile infrastructure solutions and making them accessible for operators and enterprises that want to deploy future-proof networks. our team is developing the next-gen features and applications for our IMS solution. As a Software Engineer, you'll build complex applications, optimize solutions, and improve operational efficiency. 

The ideal candidate has expertise in telephony, C/C++, Python, SIP, Diameter, and cloud-native technologies like Kubernetes. 


REQUIREMENTS: 
  • Strong programming skills in C/C++ and knowledge of Python are considered a plus. 
  • Experience with Kamailio is highly desired but not a must
  • Knowledge of telephony and signaling standards, such as SIP and Diameter 
  • Experienced and very comfortable working on UNIX/Linux operating systems 
  • Strong problem-solving and analytical skills 
  • Self-motivated and able to work autonomously 
  • Ability to adapt to a fast-paced and dynamic work environment 
  • Proficiency in English 


TASKS:

  • Develop the next generation of features and applications for our IMS solution using a test-driven development approach 
  • Collaborate with a passionate team to develop the next generation of features and applications 
  • Perform testing, validation, and optimization of solutions to ensure high-quality deliverables 
  • Identify opportunities to improve operational efficiency and propose innovative solutions 
  • Work with technologies such as Kamailio, Redis, MySQL, SIP, RTP, Diameter, C, Python, and Bash 
  • Opportunity to work on the full spectrum of IMS nodes: P-CSCF, S-CSCF, I-CSCF, RTP-Engine, MMTel, HSS, PCRF, DRA, BGCF, TOPOS, TADS, E-CSCF 
  • Understand 3GPP specs and incline the IMS solution to the standards 

Tech stack

    C++

    advanced

    SIP

    advanced

    Kamailio SIP Server

    regular

    Diameter

    regular

Office location

Published: 03.06.2024